LabDataStorageEvaluation/out/report/process_flow.md

Process Flow - Simulated Tribology Laboratory

Generated by make_process_flow.py (task 02) from out/config/lab_config.yaml. Standalone diagram sources: ./diagrams/D1..D6.mermaid.

D1 - Coupon Assembly

Substrate preparation, adhesion layer, and gradient Pt-Au sputter deposition.

flowchart LR
    A([Ti-6Al-4V Base 10x10x3 mm]) --> B[Cleaning]
    B --> B1([Rinsed in deionized water])
    B1 --> B2([Sonicated in cleaning solution])
    B --> C[Smearing Adhesive]
    C --> C1([Cr adhesive coating])
    C --> D[Vapor Deposition System<br/>Kurt J. Lesker PVD 200]
    D --> D1([PtAu sputter coating, gradient])
    D --> E([Test Coupon])

D2 - Characterization and Batch Assembly

Per-coupon simulation and thickness characterization, then assembly into wafers (x49 coupons) and batches (x3 wafers), deposited per the parameter table below.

flowchart LR
    TC([Test Coupon]) --> S[SIMTRA simulation<br/>composition / atom energies]
    S --> OP[Optical profilometry<br/>film thickness 0.3-1.1 um]
    OP --> TW[Assemble Test Wafer<br/>x49 coupons]
    TW --> TB[Assemble Test Batch<br/>x3 wafers]
    TB --> B721[B721<br/>Pt 150 W / Au 50 W]
    TB --> B722[B722<br/>Pt 100 W / Au 100 W]
    TB --> B723[B723<br/>Pt 150 W / Au 50 W]
    TB --> B724[B724<br/>Pt 50 W / Au 150 W]

Deposition matrix:

Batch	Pt:Au gun tilt	Pt power W	Au power W	Pt discharge V	Au discharge V
B721	20:0 deg	150	50	432	311
B722	20:20 deg	100	100	399	352
B723	20:20 deg	150	50	430	311
B724	0:20 deg	50	150	376	340

D3 - Testing Tree

The four characterization/testing paths every coupon can take.

flowchart TD
    TC([Test Coupon]) --> F[Friction<br/>RAPID 6-probe tribometer]
    F --> FA([Lab Air -> COF dataset mu_normal])
    F --> FN([Dry N2 -> COF dataset mu_dry_nit])
    TC --> NI[Nanoindentation<br/>Bruker TI980]
    NI --> NIR([Hardness, reduced modulus<br/>25 indents per coupon])
    TC --> AF[AFM]
    AF --> AFR([Topography -> Ra / Rq])
    TC --> XR[micro-XRF<br/>Bruker M4 Tornado]
    XR --> XRR([Pt/Au wt% map, 20x20 grid])

D4 - Tribometer Session Sequence

Operator workflow for one RAPID tribometer session, from test request to teardown.

sequenceDiagram
    actor Op as Operator
    participant Prep as Sample Prep
    participant Plan as Excel Test Plan
    participant SW as Control Software
    participant TR as RAPID Tribometer

    Op->>Prep: Request test
    Op->>Prep: Get samples
    Op->>Prep: Load samples onto plates
    Op->>Prep: Load ball holders (3 counterfaces per holder)
    Op->>Plan: Create test plan<br/>(Sample Plate, Plate Location, Sample ID, Save Location,<br/>Folder Name, X/Y/Z Offset, Load, Iterations)
    Op->>TR: Transfer plates to tribometer
    Op->>TR: Set up platter
    Op->>SW: Activate software
    Op->>SW: Load plan
    SW->>TR: Activate tribometer
    TR-->>SW: Run reciprocating tests (execution loop, see D5)
    Op->>SW: Software stop
    SW-->>Op: Save avg files
    Op->>TR: Remove plates and platters
    Op->>SW: Close software
    Op->>TR: Pull equipment out

D5 - Execution Loop

Nested iteration executed by the tribometer within one run.

flowchart TD
    L[Load all counterfaces] --> P{5 plates}
    P -->|for each plate| PR{6 probes in parallel}
    PR -->|for each probe| C{4 coupons on coupon square}
    C -->|for each coupon| T[Draw track]
    T --> RC[Rotate counterface - fresh ball per track]
    RC -->|3 tracks per coupon| T
    T --> DONE([120 coupons x 3 tracks = 360 tracks per run])

D6 - Data Hierarchy

Entity containment and per-entity measurement datasets (ERD-style).

erDiagram
    DEPOSITION_RUN ||--|| SIMTRA_PROFILE : produces
    DEPOSITION_RUN ||--|| BATCH : creates
    BATCH ||--|{ WAFER : contains
    WAFER ||--|{ COUPON : contains
    COUPON ||--|| XRF_MAP : has
    COUPON ||--|| NANOINDENTATION : has
    COUPON ||--|| AFM : has
    COUPON ||--|| PROFILOMETRY : has
    COUPON ||--o{ TRACK : "friction coupons only"
    TRACK ||--|{ CYCLE : has
    TRACK ||--|{ LOOP_POINT : has
    TRACK ||--|| WEAR : has