feat(config): update .gitignore to exclude output artifacts and add config files

- ignore all output files except for reports and config directories - add new .done files for tasks 01-11 to track completion status - include new configuration files for hardware prices and lab setup - generate process flow and report documents for tasks 02 and 11
2026-07-11 23:52:28 -04:00
parent a4c0d258eb
commit af91629f71
41 changed files with 1028 additions and 1 deletions
--- a/out/report/process_flow.md
+++ b/out/report/process_flow.md
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+# Process Flow - Simulated Tribology Laboratory
+
+Generated by make_process_flow.py (task 02) from out/config/lab_config.yaml.
+Standalone diagram sources: ./diagrams/D1..D6.mermaid.
+
+## D1 - Coupon Assembly
+
+Substrate preparation, adhesion layer, and gradient Pt-Au sputter deposition.
+
+```mermaid
+flowchart LR
+    A([Ti-6Al-4V Base 10x10x3 mm]) --> B[Cleaning]
+    B --> B1([Rinsed in deionized water])
+    B1 --> B2([Sonicated in cleaning solution])
+    B --> C[Smearing Adhesive]
+    C --> C1([Cr adhesive coating])
+    C --> D[Vapor Deposition System<br/>Kurt J. Lesker PVD 200]
+    D --> D1([PtAu sputter coating, gradient])
+    D --> E([Test Coupon])
+```
+
+## D2 - Characterization and Batch Assembly
+
+Per-coupon simulation and thickness characterization, then assembly into wafers (x49 coupons) and batches (x3 wafers), deposited per the parameter table below.
+
+```mermaid
+flowchart LR
+    TC([Test Coupon]) --> S[SIMTRA simulation<br/>composition / atom energies]
+    S --> OP[Optical profilometry<br/>film thickness 0.3-1.1 um]
+    OP --> TW[Assemble Test Wafer<br/>x49 coupons]
+    TW --> TB[Assemble Test Batch<br/>x3 wafers]
+    TB --> B721[B721<br/>Pt 150 W / Au 50 W]
+    TB --> B722[B722<br/>Pt 100 W / Au 100 W]
+    TB --> B723[B723<br/>Pt 150 W / Au 50 W]
+    TB --> B724[B724<br/>Pt 50 W / Au 150 W]
+```
+
+Deposition matrix:
+
+| Batch | Pt:Au gun tilt | Pt power W | Au power W | Pt discharge V | Au discharge V |
+|---|---|---|---|---|---|
+| B721 | 20:0 deg | 150 | 50 | 432 | 311 |
+| B722 | 20:20 deg | 100 | 100 | 399 | 352 |
+| B723 | 20:20 deg | 150 | 50 | 430 | 311 |
+| B724 | 0:20 deg | 50 | 150 | 376 | 340 |
+
+## D3 - Testing Tree
+
+The four characterization/testing paths every coupon can take.
+
+```mermaid
+flowchart TD
+    TC([Test Coupon]) --> F[Friction<br/>RAPID 6-probe tribometer]
+    F --> FA([Lab Air -> COF dataset mu_normal])
+    F --> FN([Dry N2 -> COF dataset mu_dry_nit])
+    TC --> NI[Nanoindentation<br/>Bruker TI980]
+    NI --> NIR([Hardness, reduced modulus<br/>25 indents per coupon])
+    TC --> AF[AFM]
+    AF --> AFR([Topography -> Ra / Rq])
+    TC --> XR[micro-XRF<br/>Bruker M4 Tornado]
+    XR --> XRR([Pt/Au wt% map, 20x20 grid])
+```
+
+## D4 - Tribometer Session Sequence
+
+Operator workflow for one RAPID tribometer session, from test request to teardown.
+
+```mermaid
+sequenceDiagram
+    actor Op as Operator
+    participant Prep as Sample Prep
+    participant Plan as Excel Test Plan
+    participant SW as Control Software
+    participant TR as RAPID Tribometer
+
+    Op->>Prep: Request test
+    Op->>Prep: Get samples
+    Op->>Prep: Load samples onto plates
+    Op->>Prep: Load ball holders (3 counterfaces per holder)
+    Op->>Plan: Create test plan<br/>(Sample Plate, Plate Location, Sample ID, Save Location,<br/>Folder Name, X/Y/Z Offset, Load, Iterations)
+    Op->>TR: Transfer plates to tribometer
+    Op->>TR: Set up platter
+    Op->>SW: Activate software
+    Op->>SW: Load plan
+    SW->>TR: Activate tribometer
+    TR-->>SW: Run reciprocating tests (execution loop, see D5)
+    Op->>SW: Software stop
+    SW-->>Op: Save avg files
+    Op->>TR: Remove plates and platters
+    Op->>SW: Close software
+    Op->>TR: Pull equipment out
+```
+
+## D5 - Execution Loop
+
+Nested iteration executed by the tribometer within one run.
+
+```mermaid
+flowchart TD
+    L[Load all counterfaces] --> P{5 plates}
+    P -->|for each plate| PR{6 probes in parallel}
+    PR -->|for each probe| C{4 coupons on coupon square}
+    C -->|for each coupon| T[Draw track]
+    T --> RC[Rotate counterface - fresh ball per track]
+    RC -->|3 tracks per coupon| T
+    T --> DONE([120 coupons x 3 tracks = 360 tracks per run])
+```
+
+## D6 - Data Hierarchy
+
+Entity containment and per-entity measurement datasets (ERD-style).
+
+```mermaid
+erDiagram
+    DEPOSITION_RUN ||--|| SIMTRA_PROFILE : produces
+    DEPOSITION_RUN ||--|| BATCH : creates
+    BATCH ||--|{ WAFER : contains
+    WAFER ||--|{ COUPON : contains
+    COUPON ||--|| XRF_MAP : has
+    COUPON ||--|| NANOINDENTATION : has
+    COUPON ||--|| AFM : has
+    COUPON ||--|| PROFILOMETRY : has
+    COUPON ||--o{ TRACK : "friction coupons only"
+    TRACK ||--|{ CYCLE : has
+    TRACK ||--|{ LOOP_POINT : has
+    TRACK ||--|| WEAR : has
+```