feat(config): update .gitignore to exclude output artifacts and add config files
- ignore all output files except for reports and config directories - add new .done files for tasks 01-11 to track completion status - include new configuration files for hardware prices and lab setup - generate process flow and report documents for tasks 02 and 11
This commit is contained in:
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out/config/hw_prices.yaml
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out/config/hw_prices.yaml
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# Hardware cost parameters for extrapolation (task 10).
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# Street prices retrieved 2026-07-11 from the sources below (server DRAM is
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# in a documented 2025-2026 price surge - see market_context). The cost
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# model buys whole components: 64 GB RDIMM modules and 7.68 TB NVMe drives.
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# Operator-editable; re-run extrapolate.py after changes (code-config-yaml).
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as_of: "2026-07-11"
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ram_module_gb: 64
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ram_module_usd: 1887.0 # A-Tech 64GB (2x32GB) DDR5-5600 ECC RDIMM
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nvme_drive_tb: 7.68
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nvme_drive_usd: 3995.0 # Cloud Ninjas NEW 7.68TB NVMe U.2 1DWPD (Dell 14-16G)
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server_16_core_usd: 4618.0 # Supermicro AS-1015CS-TNR 1U (EPYC 9004/9005), Broadberry starting config
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server_32_core_usd: 6272.0 # Supermicro AS-1115CS-TNR 1U, Broadberry starting config
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extra_node_usd: 4618.0 # one additional entry 1U node (AS-1015CS-TNR chassis)
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sources:
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ram: https://atechmemory.com/collections/ddr5-memory-ram
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nvme: https://cloudninjas.com/products/new-7-68tb-nvme-u-2-1dwpd-sie-2-5-enterprise-solid-state-drive-for-14th-15th-16th-gen-dell
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servers: https://www.broadberry.com/amd-epyc-9004-supermicro-servers
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market_context: https://www.techpowerup.com/342331/server-dram-pricing-jumps-50-only-70-of-orders-getting-filled
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246
out/config/lab_config.yaml
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out/config/lab_config.yaml
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# Generated by make_lab_config.py (task 01) from docs/specs/01_lab_configuration.md.
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# Do not hand-edit: regenerate via `python make_lab_config.py`.
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project: LabDataStorageEvaluation
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description: Simulated tribology laboratory (Sandia Pt-Au LDRD context)
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spec: docs/specs/01_lab_configuration.md
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seed: 20260711
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material_system:
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substrate:
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material: Ti-6Al-4V
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dimensions_mm:
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- 10
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- 10
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- 3
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adhesion_layer:
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material: Cr
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process: sputtered
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coating:
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material: Pt-Au
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deposition: composition gradient across each wafer
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thickness_um_range:
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- 0.3
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- 1.1
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instruments:
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- instrument_id: rapid
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role: friction
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name: RAPID custom high-throughput parallelized 6-probe tribometer
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data_produced: COF vs cycle per track; test conditions
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- instrument_id: ti980
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role: nanoindentation
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name: Bruker TI980 TriboIndenter
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data_produced: hardness, reduced modulus (25 indents per coupon)
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- instrument_id: m4_tornado
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role: composition
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name: Bruker M4 Tornado micro-XRF
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data_produced: Pt/Au wt% map per coupon (20x20 grid)
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- instrument_id: pvd200
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role: deposition
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name: Kurt J. Lesker PVD 200 sputter-down
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data_produced: batch deposition parameters
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- instrument_id: afm
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role: surface_roughness
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name: AFM
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data_produced: topography image metadata + Ra/Rq per coupon
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- instrument_id: profilometer
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role: film_thickness
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name: Optical profilometry
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data_produced: thickness map per coupon (10x10 grid)
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- instrument_id: simtra
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role: simulation
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name: SIMTRA sputter transport Monte-Carlo
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data_produced: deposition atom-energy / composition profiles per deposition run
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deposition_matrix:
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- batch_code: B721
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pt_gun_tilt_deg: 20
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au_gun_tilt_deg: 0
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pt_power_W: 150
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au_power_W: 50
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pt_discharge_V: 432
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au_discharge_V: 311
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- batch_code: B722
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pt_gun_tilt_deg: 20
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au_gun_tilt_deg: 20
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pt_power_W: 100
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au_power_W: 100
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pt_discharge_V: 399
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au_discharge_V: 352
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- batch_code: B723
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pt_gun_tilt_deg: 20
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au_gun_tilt_deg: 20
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pt_power_W: 150
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au_power_W: 50
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pt_discharge_V: 430
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au_discharge_V: 311
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- batch_code: B724
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pt_gun_tilt_deg: 0
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au_gun_tilt_deg: 20
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pt_power_W: 50
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au_power_W: 150
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pt_discharge_V: 376
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au_discharge_V: 340
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hierarchy:
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batches: 4
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wafers_per_batch: 3
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coupon_grid_per_wafer:
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- 7
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- 7
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coupons_per_wafer: 49
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friction_assignment:
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friction_coupons_total: 480
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reserve_coupons_total: 108
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runs: 4
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coupons_per_run: 120
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plates_per_run: 5
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probes_per_plate: 6
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coupons_per_probe_square: 4
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tracks_per_friction_coupon: 3
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counterfaces_per_holder: 3
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fresh_counterface_per_track: true
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reserve_grid_positions:
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- 1
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- 4
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- 7
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- 22
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- 25
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- 28
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- 43
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- 46
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- 49
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volumes:
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coupons_total: 588
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tracks_total: 1440
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cycles_per_track: 1000
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cycle_rows_total: 1440000
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loop_every_n_cycles: 100
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loops_per_track: 10
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loop_points_per_loop: 200
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loop_points_total: 2880000
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xrf_grid:
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- 20
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- 20
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xrf_points_per_coupon: 400
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xrf_points_total: 235200
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profilometry_grid:
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- 10
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- 10
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profilometry_points_per_coupon: 100
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nanoindentation_indents_per_coupon: 25
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simtra_rows_per_batch: 1000
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runs:
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- run_code: R1
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batch_code: B721
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environment: lab_air
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date: '2026-04-06'
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operator: A. Reyes
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- run_code: R2
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batch_code: B722
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environment: lab_air
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date: '2026-04-13'
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operator: K. Patel
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- run_code: R3
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batch_code: B723
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environment: dry_n2
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date: '2026-04-20'
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operator: A. Reyes
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- run_code: R4
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batch_code: B724
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environment: dry_n2
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date: '2026-04-27'
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operator: M. Novak
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schedule:
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deposition_start_date: '2026-03-02'
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batch_interval_days: 7
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characterization_lag_days: 3
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run_start_time: 09:00:00
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track_interval_s: 2100
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test_conditions:
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normal_load_mN: 100
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stroke_mm: 1.0
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speed_mm_s: 1.0
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counterface:
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material: ruby (Al2O3)
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diameter_mm: 3.175
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rh_pct:
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lab_air: 45
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dry_n2: 2
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temperature_C: 23
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temperature_tolerance_C: 1
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physical_models:
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au_gradient:
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description: linear Au wt% gradient along wafer x, batch-dependent center
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batch_center_wtpct:
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B721: 8
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B722: 25
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B723: 10
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B724: 60
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wafer_span_wtpct: 5
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xrf_noise_sd_wtpct: 0.3
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cof_run_in:
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formula: cof(c) = cof_ss + (cof_0 - cof_ss) * exp(-c / tau) + N(0, sigma)
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cof_0_range:
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- 0.35
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- 0.5
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tau_cycles_range:
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- 100
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- 400
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noise_sd: 0.01
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cof_steady_state:
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formula: cof_ss = intercept + slope_per_au_wtpct * au_wtpct_mean, clamped to >= floor
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lab_air:
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intercept: 0.32
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slope_per_au_wtpct: -0.0015
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dry_n2:
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intercept: 0.24
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slope_per_au_wtpct: -0.0012
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floor: 0.12
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hardness_GPa:
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formula: H = intercept + slope_per_au_wtpct * au_wtpct_mean + N(0, noise_sd)
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intercept: 8.5
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slope_per_au_wtpct: -0.05
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noise_sd: 0.25
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reduced_modulus_GPa:
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formula: Er = intercept + slope_per_au_wtpct * au_wtpct_mean + N(0, noise_sd)
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intercept: 190
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slope_per_au_wtpct: -0.6
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noise_sd: 4
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roughness_ra_nm:
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distribution: lognormal
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median_nm: 5
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sigma_log: 0.3
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rq_over_ra: 1.25
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thickness_um:
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profile: radial parabolic across wafer plus noise
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center_um: 1.05
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edge_um: 0.35
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noise_sd_um: 0.02
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range_um:
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- 0.3
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- 1.1
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wear_archard:
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formula: V = k * F * s; k = k0 * (1 + slope_per_au_wtpct * au_wtpct_mean), lognormal noise, clamped
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to >= k_floor
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k0_mm3_per_N_m:
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lab_air: 1.5e-07
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dry_n2: 6.0e-08
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slope_per_au_wtpct:
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lab_air: -0.008
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dry_n2: -0.01
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k_floor_mm3_per_N_m: 1.0e-09
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noise_sigma_log: 0.15
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friction_loop:
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force_noise_sd_mN: 0.3
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nanoindentation:
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max_load_mN: 10
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indent_grid:
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- 5
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- 5
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grid_pitch_um: 20
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simtra:
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angle_deg_range:
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- 0
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- 90
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energy_eV_max: 50
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surface_binding_energy_eV:
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pt: 5.84
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au: 3.81
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flux_per_W: 0.02
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